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μ PG2157T5F
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
S o l d e r i n g M e t h o d
S o l d e r i n g C o n d i t i o n s
C o n d i t i o n S y m b o l
Infrared Reflow
Wave Soldering
Peak temperature (package surface temperature)
T i m e a t p e a k t e m p e r a t u r e
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
T i m e a t p e a k t e m p e r a t u r e
: 260 ° C or below
: 1 0 s e c o n d s o r l e s s
: 60 seconds or less
: 1 2 0 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 1 0 s e c o n d s o r l e s s
IR260
WS260
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 1 time
: 0.2%(Wt.) or below
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10641EJ02V0DS
7
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